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MBD-X11SPW-CTF-O

Manufacture Part Number: MBD-X11SPW-CTF-O
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Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
  2. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  3. Intel® C622 chipset
  4. Expansion slots:
    1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot
  5. 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
  6. 2 10GbE LAN ports
  7. 10 SATA3 (6Gbps) via C622
  8. I/O: 1 VGA, 2 COM, TPM header
  9. 2 SuperDOM with built-in power
  10. M.2 NGFF connector
    M.2 Interface: PCI-E 3.0 x4 and SATA
    Form Factor: 2280, 22110
    Key: M-Key
    Double Height Connector

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