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MBD-X11DDW-NT-O

Manufacture Part Number: MBD-X11DDW-NT-O
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Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
    Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
  2. Intel® C622
  3. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;
    Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
  4. 1 PCI-E 3.0 x32 Left Riser Slot,
    1 PCI-E 3.0 x16 Right Riser Slot,
    1 PCI-E 3.0 x16 for Add-On-Module (AOM)
    M.2 Interface: PCI-E 3.0 x4
    M.2 Form Factor: 2242, 2260, 2280, 22110
    M.2 Key: M-Key
    U.2 Interface: PCI-E 3.0 x4,
    4 PCI-E 3.0 NVMe x4 Internal Port(s)
  5. 1 VGA port
  6. Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. Dual LAN with 10Gbase-T
    from C622

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