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MBD-X11SPG-TF-O

Manufacture Part Number: MBD-X11SPG-TF-O
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Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
  2. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
  3. Intel® C621 Chipset
  4. 3 PCI-E 3.0 x16
  5. 2 10GbE LAN ports
  6. 6 SATA (6Gbps)
  7. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 4 USB 2.0 (2 rear, 2 via headers)
  8. 2 SuperDOM with built-in power
  9. I/O: 1 VGA, 1 COM, TPM header
  10. 2x M.2 NGFF connectors
    M.2 Interface: PCI-E 3.0 x4 and SATA
    Form Factor: 2280
    Key: M-Key
    Double Height Connector

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