Toggle Nav
Loading.. Please Wait
Loading...

MBD-X11SPH-nCTPF-O

Manufacture Part Number: MBD-X11SPH-nCTPF-O
Our Price: Login for price
Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
  2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
  3. Intel® C622 chipset
  4. Expansion slots:
    1 PCI-E 3.0 x16 (x16 || x8),
    1 PCI-E 3.0 x8 (x0 || x8),
    1 PCI-E 3.0 x8,
    1 PCI-E 3.0 x4 (in x8)
  5. 2 10G SFP+
  6. 10 SATA3 (6Gbps) via C622
  7. 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
  8. 2x Port NVMe PCI-E 3.0 x4 via OCuLink
  9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
  10. M.2 NGFF connector
    M.2 Interface: PCI-E 3.0 x4 and SATA
    Form Factor: 2280
    Key: M-Key
    Double Height Connector

Categories

Manufacturer