Toggle Nav
Loading.. Please Wait
Loading...

MBD-X11SPM-TF-O

Manufacture Part Number: MBD-X11SPM-TF-O
Our Price: Login for price
Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W TDP
  2. Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
    Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
  3. Intel® C622 chipset
  4. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
  5. 2 10GbE LAN ports
  6. 12 SATA3 (6Gbps) via C622
  7. Supports 12V DC power input
  8. I/O: 1 VGA, 2 COM, TPM header
  9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
  10. M.2 NGFF connector
    M.2 Interface: PCI-E 3.0 x4
    Form Factor: 2242, 2280
    Key: M-Key
    Double Height Connector

Categories

Manufacturer