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MBD-X11DPX-T-B

Manufacture Part Number: MBD-X11DPX-T-B
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Product cycle: Current
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  2. Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
  3. Intel® C621
  4. Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
  5. Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    1. 2 PCI-E 3.0 x16,
    2. 8 PCI-E 3.0 x8,
    3. 1 PCI-E 3.0 x4 (in x8 slot) Or 4 PCI-E 3.0 x16 and 4 PCI-E 3.0 x8 and 1 PCI-E 3.0 x4 (in x8 slot)
    4. M.2 Interface: 1 PCI-E 3.0 x4
    5. M.2 Form Factor: 2280, 22110
    6. M.2 Key: M-Key
  6. 1 VGA D-Sub Connector port
  7. Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  8. Dual LAN with Intel® X550 10GBase-T Ethernet Controller

 

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