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MBD-X11SPL-F-O

Manufacture Part Number: MBD-X11SPL-F-O
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Product cycle: Current
     
  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W
  2. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
    Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
  3. Intel® C621 Chipset
  4. Expansion slots:
    2 PCI-E 3.0 x8 (in x16),
    4 PCI-E 3.0 x8,
    1 PCI-E 3.0 x4 (in x8)
  5. 2 GbE LAN ports
  6. 8 SATA3 (6Gbps) ports
  7. I/O: 1 VGA, 2 COM, TPM header
  8. 2 SuperDOM with built-in power
  9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
  10. M.2 NGFF connector
    M.2 Interface: PCI-E 3.0 x4 and SATA
    Form Factor: 2280, 22110
    Key: M-Key
    Double Height Connector

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