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MBD-X11SPA-TF-O

Manufacture Part Number: MBD-X11SPA-TF-O
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Product cycle: Current
     
  1. Intel® Xeon® Scalable Processors.
    Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
  2. Intel® C621
  3. Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz
    Or 3TB DCPMM, DDR4-2666MHz, in 12 DIMM slots
  4. 4 PCI-E 3.0 x16,
    3 PCI-E 3.0 x8 (in x16 slot),
    PCI-Ex16 Slot#1 shares with M.2, Slot#2 shares with Slot#3(NA/16,8/8), Slot#4 shares with Slot#5(NA/16,8/8), Slot#6 shares with Slot#7(NA/16,8/8)M.2 Interface: 4 PCI-E 3.0 x4, RAID 0 & 1
    M.2 Form Factor: 2242/2260/2280/22110
    M.2 Key: M-Key
    M.2 support RAID 0,1(up to RAID 5, 10), VROC key is required for Raid.
  5. 1 VGA port,
    VGA connector is dedicated for IPMI.
  6. Intel® C621 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. Single LAN with Intel® Ethernet Controller I210-AT
    Single LAN with Aquantia® AQC107 10G Ethernet Controller
    Single LAN with Realtek RTL8211E PHY (dedicated IPMI)